Providing solid state lighting design engineers with a means of dissipating heat in visible LED applications, TT electronics OPTEK Technology has developed a thermally conductive aluminum substrate.
Designated the OptoTherm(TM) OCB201 Series, the heat spreader substrates feature high thermal conductivity, creating a superior means of efficient thermal management for visible LED assemblies.
"Not only do OptoTherm substrates offer an excellent thermal path for removing heat from visible LEDs, but the dielectric is 0.004 inches thick, providing improved isolation between the copper circuit and aluminum cladding," said Alan Bennett, vice president of sales and marketing for OPTEK Technology.
"The enhanced specifications and availability of the substrates in multiple configurations allows us to meet our customers` assembly requirements for any optical, electronic, thermal management, packaging and reliability specifications."
The substrates feature a high isolation voltage, with a dielectric breakdown of 4KVDC. Copper and aluminum thicknesses are 0.0042" and 0.062", respectively. Thermal conductivity is 1.1W/mK and thermal resistance is 1.8"C/W. The substrate meets UL-94 V0 flammability specifications.
With their in-house testing and third party validation, OPTEK will also verify that the substrate characteristics meet or exceed industry standards.
Maximum substrate panel size for the OptoTherm(TM) OCB201 Series is 18 x 16.5 inches, with available thicknesses of 0.038" (0.97mm), 0.070" (1.78mm), and 0.133" (3.38mm).
